XY642 Diphenyl Containing Epoxy Resin CAS 2461-46-3 EC-No 219-556-2, 4,4'-Bis 2,3-epoxypropoxy Bipheny

Product Brief – XY642

Yellow granular solid engineered for high-reliability electronics.

Key attributes:

• Exceptional heat resistance and ultra-low moisture absorption
• Inherent flame retardancy plus high toughness and strong adhesion
• Low dielectric constant; cured resin delivers excellent dimensional and chemical stability
• Low halogen content, RoHS compliant

Typical applications
– Epoxy molding compound (EMC)
– Copper-clad laminates (CCL)
– Flexible printed circuits (FPC)
– Etch-resistant inks and solder masks